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Equipment Scale

Manufacturing Capacity


ProjectCapability

PCB board size

550mmX1200mm

PCB thickness

8mm

SMT part size

01005-74X74mm

IC Pitch

0.3mm

BGA/CSP

0.35mm

PCBA complexity

Double-sided patch, dispensing, plug-in, crimping, heat sink

Nitrogen reflow/gas phase soldering

Yes

Wave soldering/selective wave soldering

Lead-free(ERSA)

Craft

Lead-free

BGA inspection

3D,5DS

BGA rework

Yes (ERSA BGA rework station, maximum BGA 70X70mm)

Three anti-paint

Yes

ICT

Yes (software and hardware design, development)

FCT

Yes (software and hardware design, development)

Assembly

Yes

package

Yes

HASA

Yes (-100-200 degree cycle)

Ageing

Yes (50土5)

Scoreboard

Laser sub-board, mechanical sub-board

Quality Assurance

Operating standard: IPC-A-610E inspection level II (according to customer requirements)

Accept the quality level AQL: Fatal defect: 0 / Important defect: 0.4 / Minor defect: 1.0

Quality system standards: ISO 9001:2008/ISO 14001/ISO 13485 (2016)/IATF 16949/AS9001D


Cooperative Customers

  • 科馬瑞訊
  • 宇視科技
  • 正泰
  • 恒為科技
  • 宏杉科技
  • 華測
  • mnik
  • TC
  • 迪普科技
  • FES
  • H3C
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